Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

The drive for better efficiency in the power electronics industry has generated enormous gains in the last few years. The design of power semiconductors has improved, silicon carbide (SiC) and gallium ...

The Xe-100 is a 200MWt Advanced Pebble Bed Reactor that will be deployed in Washington State in the 2028 timeframe with the support of the US DOE Advanced Reactor Demonstration Program. The Xe-100 has ...

Multiphysics simulation allows engineers to evaluate complex interactions in a single environment, reducing the need for physical prototypes. In healthcare, simulation helped design electromagnetic ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...