The business of manufacturing is so competitive today that the ability to shave any time at all off the process from designing to final manufacturing of products can mean major market share and ...

For the first several weeks of 2018, Deepak Aatresh was in India working with a client on a one million-sf-plus healthcare network that is being designed with technology developed by Aditazz, which ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Ever feel like UI/UX design projects take forever to get off the ground? Between building design systems, creating prototypes, and making sure consistency across screens, the process can feel like an ...

Delcam's Die Wizard automatically finds a product model's split line and forms the two die halves. PS-Moldmaker generates a 3D, solid-model assembly of the mold and tooling. The approach is said to ...

Although still in stealth mode with a formal launch planned for later this year, executives from Palo Alto, Calif.-based startup Imperas Inc. released a few details on the company’s direction to ...

In today's lightning-fast software landscape, traditional architecture practices are becoming a bottleneck. The velocity and complexity of systems scaling across ephemeral microservices, complex APIs ...

This AI powered approach enables chip designers to evaluate design quality, manufacturability, and performance much earlier in the development process.