As chips become more heterogeneous with more integrated functionality, testing them presents increasing challenges — particularly for high-speed system-on-chip (SoC) designs with limited test pin ...
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Test data management (TDM) refers to the process of creating, maintaining, and using test data to validate the functionality of an application. TDM is a critical aspect of the testing process, as it ...
Lots of images are constantly taken and saved in high resolution, and in several context passed to AI (artificial intelligence) servers; sophisticated algorithms crunch data and process them fast ...
The variety of different test methodologies combined with today�s mixture of memory devices creates a complex test profile. The manufacturing test floor hums with activity; a range of memory devices ...
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