Magnetic flux leakage (MFL) testing is a widely established non‐destructive evaluation technique used to assess the integrity of ferromagnetic materials in applications such as pipeline inspection and ...
A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. “Fan-out ...
Final electrical test remains one of the best ways to assess a circuit’s ultimate viability. But we know that, unfortunately, even 100% end-of-line electrical testing of semiconductor wafers will not ...
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