Infineon has introduced its XENSIV SP49 tire pressure monitoring sensor, which integrates MEMS (micro-electromechanical systems) sensors and ASIC to provide advanced tire pressure monitoring systems.
A research team led by Profs. Chen Deyong and Wang Junbo from the Aerospace Information Research Institute (AIR) of the Chinese Academy of Sciences has developed a novel microsensor that enhances both ...
Able to be easily integrated into the latest electric-vehicle thermal-management systems, Melexis's MLX90830 is the company's first product to feature its Triphibian technology. This robust miniature ...
Semiconductor engineers leveraged manufacturing techniques developed for computer chips to create microscopic MEMS devices. Fabrication methods for MEMS sensors, such as layer deposition, ...