In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

SAN DIEGO, Feb. 15, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH ) ("GBT” or the “Company”), is developing an AI empowered technology for automatic compaction of integrated circuit ...

Starting with its interactive, early detection and elimination of IC’s layout design rule violations program. SAN DIEGO, April 12, 2022 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCHD) ...

For circuit simulation, we have always been enthralled with the Falstad simulator which is a simple, Spice-like simulator that runs in the browser. [Brandon] has a simulator, too, but it simulates ...

Layout for ICs at process geometries of 90 nm and below becomes a very dicey affair. Even at 180 nm, the number of design rules that must be enforced for an ASIC or system-on-a-chip to be ...