The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...
SAN JOSE, Calif., Feb. 23, 2011 /PRNewswire/ -- Novellus Systems announced today that its subsidiary Peter Wolters GmbH has introduced a new version of its microLine double side lapping system for ...
During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...
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