New technical paper titled “Wafer-scale solution-processed 2D material analog resistive memory array for memory-based computing” from researchers at National University of Singapore and Institute of ...

Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...

A pioneering type of patented computer memory known as ULTRARAM™ has been demonstrated on silicon wafers in what is a major step towards its large-scale manufacture. ULTRARAM™ is novel type of memory ...

Researchers in Japan have developed a new method for making 5-cm (2-in) wafers of diamond that could be used for quantum memory. The ultra-high purity of the diamond allows it to store a staggering ...

Groundbreaking Architectural Innovations in Scaling and Wafer Bonding Technology Deliver a Major Leap in Performance, Density and Cost Effectiveness TOKYO & SAN JOSE, Calif.--(BUSINESS ...

TL;DR: SK hynix is reportedly planning to introduce femto-second grooving and full-cut processes to its HBM4 and 400-layer and higher NAND flash, a move required as semiconductors get thinner and ...

For several decades, NAND Flash has been the primary technology for low-cost and large-density data storage applications. This non-volatile memory is present in all major electronic end-use markets, ...

The internet, social media, and digital technologies have completely transformed the way we establish commercial, personal and professional relationships. At its core, this society relies on the ...

Companies Preview 10th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density Unveiled at ISSCC 2025, the new 3D flash memory innovation, ...

The internet, social media, and digital technologies have completely transformed the way we establish commercial, personal and professional relationships. At its core, this society relies on the ...