Molex has introduced its family of VersaBeam expanded beam optical (EBO) interconnect solutions. These high-density fiber connectors, optimized for hyperscale data center, cloud and edge computing ...
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, marking a major milestone in ...
The distributor Rutronik expands its connector portfolio with the Mini-Fit family from Molex. Possible applications include automotive, industrial, telecommunications, networking or medical. Designed ...
Molex has unveiled MX-DaSH Modular Wire-to-Wire Connectors, the latest addition to its MX-DaSH family, aimed at simplifying automotive wiring while supporting advanced vehicle architectures. MX-DaSH ...
Systems supporting PCIe 7.0 interconnections with a 128 GT/s transfer rate are years away. However, companies like Molex, which specializes in connectors, are already working on connectors and cabling ...
Molex LLC has launched its new MMCX Power over Coax (PoC) solution, with a patent-pending mating technique that ensures stable connections and electrical ground continuity, solving inherent problems ...
Molex has introduced the first product in its new eHV high-voltage connector and terminal system portfolio, aimed at delivering secure and reliable electrical connections for high-voltage applications ...
WILMINGTON, Mass., March 04, 2026 (GLOBE NEWSWIRE) -- Heilind Electronics, a leading global distributor of interconnect, electromechanical, and industrial automation products, now offers the Molex ...
Molex Inc., a maker of electronic components for Apple Inc.’s iPhone and other products, agreed to a $7.2-billion acquisition by Koch Industries Inc., the holding company controlled by the billionaire ...
Molex has announced two families of FFC/FPC connectors designed to add high-reliability to small-pitch. Dubbed Easy-On FFC/FPC connectors they are available in 0.5mm pitch and 1.0mm pitch formats.
This Microwaves & RF article is reprinted here with permission. With mobile and consumer products becoming ever-smaller and thinner, OEMs feel greater pressure to simplify communications within the ...