TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
The majority of the credit goes to the DRAM, and then comes the chip costs. The year 2026 will see a breakthrough into the 2nm era. Apple has reportedly booked more than half of TSMC’s 2nm capacity.
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