In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.

CPS offers AlSiC, a metal-matrix composite pin fins substrate for liquid-cooled high-power module systems used in IGBT power modules for hybrid-electric vehicles. CPS offers AlSiC (Aluminum Silicon ...

Specialists in electronic cooling are focusing more on the problems of the power electronics industry than ever before. Much of this attention is directed at power semiconductor ICs and integrated ...

Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...