The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...

CHANDLER, Arizona--(BUSINESS WIRE)-- Rogers Corporation (NYSE:ROG) (“Rogers”), announced its plan to build a new factory in China to manufacture its curamik® AMB (Active Metal Brazed) and DBC (Direct ...

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power.

A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.

Wilmington, Delaware, United States, March 21, 2023 (GLOBE NEWSWIRE) -- Transparency Market Research Inc. – Surge in demand for electronic units for electric vehicle (EV) power modules is expected to ...

The power module packaging materials market will reach almost $6.1 billion by 2030 with a CAGR of almost 11% between 2024 and 2030, says Yole Group. The power module packaging materials market will ...

ON Semiconductor has expanded its portfolio of automotive Power Integrated Modules (PIMs) with the introduction of the STK984-190-E. ON Semiconductor expanded its portfolio of automotive Power ...

As integration and switching rates increase rapidly, the concentration of heat losses is similarly changing. The continuous trend to shrink die size steadily increases the amount of heat to be ...