The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

As integration and switching rates increase rapidly, the concentration of heat losses is similarly changing. The continuous trend to shrink die size steadily increases the amount of heat to be ...

ON Semiconductor has expanded its portfolio of automotive Power Integrated Modules (PIMs) with the introduction of the STK984-190-E. ON Semiconductor expanded its portfolio of automotive Power ...

With additional optical and electrical optimization at the module level, along with high-density encapsulation, total module power is expected to exceed 680W. DAS Solar’s progress in DBC technology ...

Thanks to the improved performance and efficiency they provide, the demand for inverterized drives and brushless DC (BLDC) motors continues to grow. These motors are widely used in consumer ...