With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry. These ultra-thin wafers are a quarter the thickness of a human hair and half ...
(RTTNews) - German semiconductor maker Infineon Technologies AG (IFNNY) announced Wednesday the development of the world's first 300 mm power gallium nitride or GaN wafer technology. The ...
A research team co-led by Professor Yang Lu from the Department of Mechanical Engineering, Faculty of Engineering, The University of Hong Kong (HKU), and Professor Chengming Li from the Institute for ...
OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of ...
Infineon Technologies AG (FSE: IFX) (OTCQX: IFNNY) today announced that the company has succeeded in developing the world's first 300 mm power gallium nitride (GaN) wafer technology. Infineon is the ...
PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
BEDFORD, Mass.--(BUSINESS WIRE)--Silicon wafer manufacturer 1366 Technologies today announced a new performance record for its Direct Wafer® technology with the achievement of 19.9% cell efficiency ...
FREIBURG, Germany and HOUSTON, Feb. 19, 2026 /PRNewswire/ -- NexWafe GmbH ("NexWafe"), a German solar technology company pioneering a proprietary direct gas-to-wafer manufacturing method to produce ...
NexWafe’s EpiNex solar wafers achieved 24.4% efficiency on a commercial M6 heterojunction (HJT) cell line, for the first time delivering performance parity with conventional CZ wafers. Modules made ...
Synthetic diamond, thanks to its superlative properties, including high breakdown field and high thermal conductivity, is the ultimate answer, promising to become the go-to material platform for the ...
Semiconductor logic and memory technology development continues to push the limits of process complexity and cost, especially as the industry migrates to the 5 nm node and beyond. Optimization of the ...
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