Chip smuggling; AI export controls; Middle East AI deals; DeepSeek's new report; OSAT revenue up; AI PC memory chipsets; big ...

Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, ...

Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...

High-voltage PCB spacing; HBM4; AI changes engineering teams; ion beam etching; wafer market and raw materials.

A new technical paper titled “Memory Prefetching Evaluation of Scientific Applications on A Modern HPC Arm-based Processor” ...

Just adding more or thicker wires to a design isn't sufficient with chiplets.

An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications” was published by researchers at EPFL.

Special report on die-to-die interconnect standards; chiplet development flows; AI accelerators move out from data centers; optimizing analog; UALink; power intent; HBM4.

Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.

They depend on careful coordination between RTL, verification and implementation teams. And here’s where things get tricky. Without a consis­tent way to describe and validate power intent across the ...