IEEE

High aspect ratio deep silicon etching

Abstract: This paper reports an improved deep reactive ion etching (DRIE) process for ultra high aspect ratio silicon trenches with reduced undercut. By ramping process pressure, etch power, and ...
IEEE

Wet Etching Process Optimization and Consistency Enhancement of Massive Through Glass Vias Through Laser-Induced Wet Etching

Abstract: Through glass via (TGV) technology presents a promising alternative for 3-D vertical interconnects in advanced packaging. As device integration progresses, the number of through vias in ...
GitHub

A Unified Anomaly Synthesis Strategy with Gradient Ascent for Industrial Anomaly Detection and Localization

This repository contains source code for GLASS implemented with PyTorch. GLASS is a unified framework designed to enhance unsupervised anomaly detection by addressing the limitations in coverage and ...
techtimes

Genmitsu Cubiko: Redefining Desktop CNC for the Next Generation of Makers

The budget CNC space isn't empty, but most entry-level machines rely on open‑frame designs that bring a pile of compromises. The Cubiko enclosed CNC router was engineered from the ground up to address ...