Spectrum-X CPO switch—jointly developed by NVIDIA and TSMC—utilizes TSMC's COUPE advanced packaging technology and delivers ...

CXMT's record-breaking IPO impacts British retailers as the memory chip shortage drives up prices. Learn which UK retailer ...

Samsung and Broadcom signed an MOU to expand cooperation in AI memory, foundry, and advanced packaging, with plans for projects worth over $200 billion through 2030. The partnership aims to secure ...

AI is powering a record year for chipmakers, but scarce server hardware and soaring memory prices remain major bottlenecks.

TAIPEI, TAIWAN -- Global NAND Flash supply is expected to outpace demand in the second half of 2027, easing the supply constraints that have persisted throughout 2026, according to TrendForce.

The NAND flash market remains undersupplied at the halfway point in 2026, driven by AI demand and limited capacity expansion, ...