Beneq introduces the Beneq Transform® XP, a second-generation ALD platform developed to meet the performance demands of Wide Bandgap (WBG) power and RF device technology development and manufacturing.

Second-generation platform delivers advanced control, in-cycle annealing, and high-throughput performance for Wide Bandgap power and RF device manufacturingESPOO, Finland, Nov. 24, 2025 /PRNewswire/ ...

RENA Technologies has launched Vanguard, a fully automated single- wafer platform designed for wet chemical cleaning, etching ...

Phemet® captures more than 16 million data points in one second with ultra-high resolution for highly accurate surface measurements of memory and logic devices and advanced packagesMUNICH, Nov. 18, ...

Wooptix, a supplier of semiconductor wavefront phase imaging metrology, today debuted its new Phemet metrology system at ...

As part of a multi-year collaboration, Nearfield Instruments will deploy its flagship system, QUADRA, at Imec’s advanced R&D facility in Leuven. The two organizations will jointly develop ...

Power, performance, and area metrics alone are no longer sufficient to capture the full range of design goals.

Bump scaling is pushing defect inspection to the limit. What comes next and why it matters.

The Ultra Lith BK’s UV curing system delivers ±5% UV intensity uniformity, ensuring consistent resist hardening across the wafer. The system supports line-scan, rotary, and hybrid UV-curing exposure ...

The global market for Consumable Parts for Semiconductor Equipment was valued at USD 18410 Million in the year 2024 and is projected to reach a revised size of USD 27250 Million by 2031, growing at a ...

HCAP Partners, a California-based private equity firm and nationally recognized impact investor, today announced its investment in IND, Inc., a provider of critical cleaning, coating, refurbishment, ...

Taiwan Semiconductor's $165 billion US manufacturing investment will ensure the future of AI chip supply chain.