Celestica reported record second-quarter revenue and raised its full-year outlook as demand for AI infrastructure and cloud computing continued to drive growth. Celestica reported record ...

Sanmina reported strong third-quarter fiscal yearly results as demand for AI infrastructure and cloud computing continued to drive growth across its manufacturing business. Sanmina reported ...

BRONSCHHOFEN, SWITZERLAND -- Cicor Group has agreed to acquire EDMI Electronics, the Malaysian manufacturing subsidiary of Singapore-based smart metering provider EDMI, as part of a long-term ...

TAIPEI, TAIWAN -- Global NAND Flash supply is expected to outpace demand in the second half of 2027, easing the supply constraints that have persisted throughout 2026, according to TrendForce.

HELSINKI, FINLAND – Incap has lowered its 2026 profit outlook, citing margin pressure in certain market segments and ongoing global material availability challenges, while maintaining its revenue ...

Schweitzer Engineering Laboratories (SEL) has begun site preparation for a new electronic device manufacturing facility in Moscow, Idaho, representing a $50 million investment that will expand the ...

Featuring a fully shielded design, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing electromagnetic interference ...

Designed for placement of the Hirose DF40C-80DP-0.4V female socket, the Custom Universal IL7 Nozzle (Part No. 2026-5682) features a 0.70 x 4.0 mm blade for secure handling during pick-and-place ...

Combining 90W laser power with LPKF's Tensor Technology, the CuttingMaster 3290 laser depaneling system processes FR-4 substrates 2.4 mm thick and greater, along with ceramic, flex and rigid-flex ...

Available with new high-power (-HP) and ultra-high-power (-UP) options, the RMCA Series automotive grade thick-film chip resistors provide greater power density without increasing component footprint.

EINDHOVEN, THE NETHERLANDS -- Keiron Printing Technologies has raised $24 million to accelerate commercialization of its laser-Induced forward transfer (LiFT) solder paste printing technology for ...

Featuring a fully shielded structure, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing EMI. The 0.35mm-pitch ...