Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Chiplet-based architectures are gaining popularity for ...

FlexTech issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive ... SEMI and 23 member companies ...

The SEMI Silicon Manufacturers Group (SMG) reported that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 ... SEMI announced the ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.

Henkel announces that it will host a live technical webinar on May 19th and 20th tailored for semiconductor design engineers and manufacturers preparing for the next ... Telecom networks are evolving ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Robotic Cover Sealer (RCS) is a fully digital, ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Koh Young is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), ... Koh Young America announced two ...

Fraunhofer IPMS is introducing a new technology called Li-Fi Grathus®, which transmits data via light instead of cable or radio waves. The system delivers gigabit-speed ... Semiconductor Packaging ...

The SEMI Silicon Manufacturers Group (SMG) reported that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 ... SEMI announced the ...

International SubFAB Research Labs (ISRL USA) and AI Infrastructure Partners (AIIP) announced a memorandum of understanding (MOU) to design, build, and operate ... Semiconductor Packaging News is ...