CEO Michael Plisinski highlighted a record quarterly revenue of $264 million for Q4 2024, attributed to strong AI packaging demand and growth in the specialty and advanced packaging markets. He ...

For Q2 2025, the company projects revenue between $21 million and $23 million, with adjusted EBITDA expected to be nominally positive. Management remains cautious due to ongoing market softness but ...

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, celebrated the official opening of ERS Barbing, its new state-of-the-art production and R&D ...

AblePrint Technology (APT), a supplier of pneumatic and thermal process solutions for semiconductor packaging, has reported ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

Discover how smart packaging, AI, and light therapy are revolutionising beauty, enhancing skin care efficacy, sustainability, ...

Despite the US's new tariff policy and other macroeconomic circumstances, TSMC is on track to boost its 2nm and advanced ...

A multimillion-pound research project, called SustaPack, aims to overcome manufacturing challenges for the next generation of ...

The profit margins for semiconductor company Inari Amertron Bhd are set to be diluted in the coming few years following new ...

Harpak-ULMA has unveiled the ARTIC SS Chevron, an advanced horizontal flow wrap machine tailored for medical and ...

Apple has reportedly started mass production of its next-gen M5 processor: will power new MacBook Pros, iPad Pros, and new ...

APT’s net profit expanded 24.5 percent to NT$607.62 million during the first three quarters of last year, compared with ...