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raypcb.com
What is Wire Bonding? - RayPCB
Wirebonding Temperature (oC) Pressure Wire Ultrasonic energy Thermocompression 300 – 500 High Au No Ultrasonic 25 Low Au, Al Yes Thermosonic 100 – 150 Low Au Yes Introduction Wire bonding is a method used to electrically and mechanically join conductive wires to semiconductor chips and substrates to make interconnections. It is a key ...
May 6, 2021
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